ICS29.045 H80/84 团体标准 T/IAWBS001-2021 代替T/IAWBS001-2017 2021-09-16发布 中关村天合宽禁带半导体技术创新联盟发布碳化硅单晶 Monocrystallinesiliconcarbide 2021-09-23实施 全国团体标准信息平台 T/IAWBS001—2021 I目次 前  言··········································································································II 1范围·············································································································1 2规范性引用文件······························································································1 3术语和定义····································································································1 4产品分类·······································································································2 4.1分类·······································································································2 4.2牌号·······································································································2 4.3规格·······································································································2 5技术要求·······································································································2 5.1直径及允许误差························································································2 5.2电阻率····································································································3 5.3参考面取向和位置·····················································································3 5.4参考面长度······························································································3 5.5表面取向及偏离度·····················································································3 5.6晶体完整性······························································································4 5.7晶体的杂质含量························································································4 6检测方法·······································································································4 6.1直径·······································································································4 6.2电阻率····································································································4 6.3晶向·······································································································4 6.4参考面取向······························································································4 6.5切口尺寸·································································································4 6.6参考面长度······························································································4 6.7晶型·······································································································5 6.8晶体完整性······························································································5 6.9高纯半绝缘晶体的杂质含量·········································································5 7检验规则·······································································································5 7.1检验与验收······························································································5 7.2检验批····································································································5 7.3检验项目·································································································5 7.4抽样·······································································································5 7.5等级判定·································································································6 7.6不合格品处置···························································································6 7.7检验条件·································································································6 8标志、包装、运输、贮存和随行文件···································································6 8.1标志·······································································································6 8.2产品包装、装箱·················